http://www.murata.com/ data sheet ! note: 1. this datasheet is downloaded from the website of murata manufacturing co., ltd. therefore, it?s specifications are subject t o change or our products in it may be discontinued without advance notice. please check with our sales representatives or product engineers bef ore ordering. 2. this datasheet has only typical specifications because there is no space for detailed specifications. therefore, please appr ove our product specifications or transact the approval sheet for product specifications before ordering. 1 o this data sheet is applied for lc combined chip emifil r used for general electronics equipment for your design. 2011.1.13 noise suppression products/emi suppression filters > emifil r (lc combined) > multilayer type 0.2 min. 0.6 0.1 0.8 0.1 1.6 0.1 (2) (3) (3) (1) (1) (2) 0.4 0.1 0.3 0.1 0.3 0.1 0.15 0.1 0.15 0.1 0.15 0.1 (in mm) : electrode frequency (mhz) 0 20 40 60 80 1 10 100 1000 2000 nfl18sp207x1a3 nfl18sp157x1a3 nfl18sp307x1a3 nfl18sp507x1a3 insertion loss (db) (50 ? - 50 ? ) gnd (2) (1) input output (3) no polarity. emifil r (lc combined) multilayer type nfl18sp series (0603 size) dimensions insertion loss characteristics (main items) equivalent circuit packaging code packaging minimum quantity d 180mm paper tape 4000 b bulk(bag) 1000 rated value ( p : packaging code) part number nominal cut-off frequency capacitance inductance rated current rated voltage insulation resistance (min.) withstand voltage operating temperature range nfl18sp157x1a3 p 150mhz 34pf 20 100nh 20% 100ma 10vdc 1000m ohm 30vdc -55 to +125 c nfl18sp207x1a3 p 200mhz 24pf 20 80nh 20% 100ma 10vdc 1000m ohm 30vdc -55 to +125 c nfl18sp307x1a3 p 300mhz 19pf 20 60nh 20% 100ma 10vdc 1000m ohm 30vdc -55 to +125 c nfl18sp507x1a3 p 500mhz 11pf 20 38nh 20% 100ma 10vdc 1000m ohm 30vdc -55 to +125 c number of circuits: 1 ! caution (rating) do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. notice solderability of tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the tin melting point is used. please confirm the solderability of tin plating termination chip before use. ! caution/notice
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